ESCOSY Plus software package for failure analysis tools
With shrinking dimensions the smallest defects can bring wafer production to a halt. Semiconductor failure analysis
and defect inspection, are faced with the challenges of fast accurate and reliable navigation to the defect location on a number of analytical instruments.
ESCOSY Plus software package can be configured to your needs
The solutions above can be offered as one integrated system.
New easy-to-use user interface with larger display and faster video handling
Main advantages of V6
- Improved User Interface
- Wider higher-resolution monitor display
- Fixed data bar with graphical icons
- Optimized usability and ergonomics
- Speed enhancements (3X to 6X advantage)
- Faster video handling applications
- Direct imported image navigation
All these new functions are compatible with all existing options
ESCOSY version 6
with its trailblazing features ideally supports your Physical and Elecrical Failure Analysis activities.