Perfecting Large Area, High Resolution SEM Imaging with 3D Stitching – Webinar

In large area, high resolution SEM imaging applications in semiconductor reverse engineering, materials science, and life sciences (e.g. connectomics), traditional SEM instruments are inherently limited by small, uncalibrated fields of view (FOVs) and imprecise sample positioning. These limitations affect image capture throughput, requiring more stage drive time and larger image overlaps, and also introduce stitching errors in 3 dimensions of the image data, X, Y, and Z. A webinar hosted  by Microscopy and Analysis at the end of June presented methods of addressing these challenges. If you missed it and want to see how the resolution and flexibility of an SEM can be combined with the stability and automation of an EBL tool, click here to watch the full webinar.

stitched SEM image of a spinal cord
A 1.6 mm x 0.7 mm large area cross section of spinal cord with high-resolution images extracted, captured with 100 µm x 100 µm corrected FOVs.
A large area image of an integrated circuit for reverse engineering
A large area image of an integrated circuit for reverse engineering

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