The 3D SEM imaging solution for chip design recovery, layout reconstruction, anti-counterfeiting, IP protection and brain mapping
Large-area, ultra-high-resolution 3D SEM imaging applications in chip reverse engineering, materials science, and life sciences (e.g. connectomics), require surfaces of up to cm² areas to be scanned with nm resolution and excellent layer to layer accuracy (‘3D stitching’) for layout and schematic extraction or 3D modeling. While traditional SEM instruments are inherently limited by small, uncalibrated fields of view (FOVs) and imprecise sample positioning, CHIPSCANNER addresses these challenges by combining the resolution and flexibility of an SEM instrument with the accuracy, stability, and automation of an electron beam lithography (EBL) instrument. High-resolution, large-area image mosaics are created by capturing sequential SEM images and stitching them together for further analysis, while the laser interferometer stage and field-of-view calibration minimize overlap and concomitant computing.
With its unique combination of high-resolution SEM imaging, multiple electron detectors, laser interferometer stage positioning, and FOV calibration, CHIPSCANNER produces the most accurate large-area, high-resolution images directly acquired by an SEM instrument. Since the absolute position of each pixel even over cm² is ultimately known to the accuracy afforded by the laser interferometer stage, these images can be stacked (3D-stitched) with the highest possible accuracy.
- Calibrated images
- Minimum image overlap
- Best layer to layer accuracy (Laser Interferometer Controlled Stage)
Large-area image mosaics with highest stitching accuracy
Calibrated image scans of up to 50,000 x 50,000 pixels reduce the number of images and seams while still minimizing pixel sizes. Height-sensor-based focus correction, sample pre-leveling technologies and built-in temperature stabilization (optional) deliver homogenous large-area image mosaics with smallest stitching errors. The very high beam current stability additionally delivers extremely stable brightness/contrast values. Finally, the ultra-high performance at low kV permits imaging of both charging semiconductors and sensitive biological samples.
Depending on the selected stage travel range, multiple samples can be loaded and image mosaics can automatically be acquired without user interaction. Software tools are available to extract and optimize valuable GDSII-CAD data from the images for further semiconductor processing.
With its high accuracy, stability, and resolution, CHIPSCANNER is the perfect large-area imaging SEM solution whenever a high-resolution SEM image analysis of large areas is needed, for example in IC reverse engineering or biological applications such as brain mapping.
To learn more about the CHIPSCANNER you can also watch the webinar "Perfecting Large Area, High Resolution SEM Imaging with 3D-Stitching" brought to you in cooperation with Microscopy and Analysis.
CHIPSCANNER Product Details
The CHIPSCANNER series consists of the following three systems, covering stages from 2"–6" and allowing for wafer loading of up to 8":
The following product details apply for all three systems.
- Chipscanner Series System Product Brochure(PDF)
- Raith Nanofabrication and SEM Instrument Technologies Brochure(PDF)
- Product Portfolio Brochure